Title:
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/240092
Kind Code:
A1
Abstract:
A thermosetting resin composition for a semiconductor sealing material contains a polyimide compound obtained by copolymerizing at least a compound having two or more N-substituted maleimide groups and a compound having two or more amino groups, an inorganic filler in a content amount of 60-95% by volume relative to the entire thermosetting resin composition for a semiconductor sealing material, and a curing initiator, the thermosetting resin composition for a semiconductor sealing material being such that the mass reduction when heated for one hour at 180°C is 5% by mass or less.
Inventors:
FUJIYASU YOSUKE (JP)
KASAHARA AYA (JP)
KIGUCHI KAZUYA (JP)
FUJIMOTO DAISUKE (JP)
KASAHARA AYA (JP)
KIGUCHI KAZUYA (JP)
FUJIMOTO DAISUKE (JP)
Application Number:
PCT/JP2019/022973
Publication Date:
December 19, 2019
Filing Date:
June 10, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L79/00; C08K3/36; H01L23/29; H01L23/31
Foreign References:
| JPH06256515A | 1994-09-13 | |||
| JPH03131628A | 1991-06-05 | |||
| JPH0258540A | 1990-02-27 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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