Title:
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/256005
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition containing an epoxy resin and thermally conductive particles. A cured product obtained by heating said thermosetting resin composition at 200°C for 90 minutes has a thermal conductivity λ200 at 200°C of at least 12 W/(m∙K). Also, said cured product has a volume resistivity R200 at 200°C of preferably at least 1.0×1010 Ω∙m. In addition, provided is a resin sheet using said thermosetting resin composition. Furthermore, provided is a metal base substrate using said thermosetting resin composition.
Inventors:
KASHINO TOMOMASA (JP)
NISHIKAWA YOSHIKI (JP)
ENDO TADASUKE (JP)
NISHIKAWA YOSHIKI (JP)
ENDO TADASUKE (JP)
Application Number:
PCT/JP2020/023728
Publication Date:
December 24, 2020
Filing Date:
June 17, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/18; B32B27/38; C08G59/40; C08K3/01; C08L63/00
Domestic Patent References:
| WO2013065758A1 | 2013-05-10 |
Foreign References:
| JP2005171170A | 2005-06-30 | |||
| JP2016155946A | 2016-09-01 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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