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Title:
THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR COMPONENT, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/216229
Kind Code:
A1
Abstract:
A thermosetting resin composition which contains a thermosetting resin, an activator and a thixotropy-imparting agent. The thermosetting resin contains a base material and a curing agent. The base material contains a bi- or higher functional oxetane compound.

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Inventors:
FUKUHARA YASUO
YAMAGUCHI ATSUSHI
Application Number:
PCT/JP2017/021463
Publication Date:
November 29, 2018
Filing Date:
June 09, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G65/18; C08L63/00; C08L71/02; H01L23/29; H01L23/31
Domestic Patent References:
WO2017110052A12017-06-29
Foreign References:
JP2011063727A2011-03-31
JP2004202518A2004-07-22
JP2006057007A2006-03-02
JP2012036377A2012-02-23
JP2009120780A2009-06-04
JP2016104888A2016-06-09
JP2012190719A2012-10-04
JP2013116558A2013-06-13
JP2013190689A2013-09-26
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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