Title:
THERMOSETTING RESIN COMPOSITION AND SHEET
Document Type and Number:
WIPO Patent Application WO/2020/116467
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition that can be cured at a low temperature and that has both heat resistance and flexibility after being cured. In order to solve the problem, the present invention provides a thermosetting resin composition characterized by containing components (A)-(D): (A) a poly-maleimide compound having two or more maleimide groups and having a weight average molecular weight not less than 500 g/mol; (B) an epoxy compound; (C) a polyester; and (D) an aromatic amine compound.
Inventors:
SHINSEI EIJI (JP)
INOUE NAOKO (JP)
HASHIMOTO TAKAYUKI (JP)
INOUE NAOKO (JP)
HASHIMOTO TAKAYUKI (JP)
Application Number:
PCT/JP2019/047289
Publication Date:
June 11, 2020
Filing Date:
December 03, 2019
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08G59/50; C08K5/18; C08L63/00; C08L67/02
Domestic Patent References:
| WO2017195304A1 | 2017-11-16 |
Foreign References:
| JP2017179184A | 2017-10-05 | |||
| JPH06329762A | 1994-11-29 | |||
| JPH02311550A | 1990-12-27 | |||
| JP2018065904A | 2018-04-26 | |||
| JP2018012248A | 2018-01-25 | |||
| JP2018131513A | 2018-08-23 | |||
| JP2001011295A | 2001-01-16 | |||
| JPS60192779A | 1985-10-01 | |||
| JPH02283757A | 1990-11-21 |
Attorney, Agent or Firm:
TOKKYO GYOMUHOJIN YUKON (JP)
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