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Patent Searching and Data


Title:
THERMOSETTING RESIN, COMPOSITION, UNCURED MOLDED BODY, PARTIALLY CURED MOLDED BODY, CURED MOLDED BODY, AND METHOD FOR PRODUCING THERMOSETTING RESIN
Document Type and Number:
WIPO Patent Application WO/2023/074518
Kind Code:
A1
Abstract:
Provided are a benzoxazine-based thermosetting resin having exceptional thermoplasticity during remolding, and a method for producing the thermosetting resin. A thermosetting resin having a benzoxazine ring structure in the main chain, wherein the thermosetting resin has a tetravalent aromatic group derived from a bifunctional phenol compound (A) and a bifunctional epoxy compound (B), a tetravalent aromatic group derived from the bifunctional phenol compound (A), and a divalent aromatic group derived from an aromatic diamine compound (C).

Inventors:
NONOMURA ASATO (JP)
Application Number:
PCT/JP2022/039062
Publication Date:
May 04, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08G14/073; C08L61/34
Foreign References:
JP2009046590A2009-03-05
JP2011074288A2011-04-14
JP2008291070A2008-12-04
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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