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Title:
THERMOSETTING RESIN FILM, COMPOSITE SHEET, AND METHOD FOR MANUFACTURING FIRST PROTECTIVE FILM-EQUIPPED SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2021/172410
Kind Code:
A1
Abstract:
In this thermosetting resin film, when the thermosetting resin film having a size of 10mm×10mm×1mm is used as a first test piece, a gelation time period between a time point at which the first test piece is put onto a stainless plate that is of a cavity-equipped sample holder of the "Madoka" automatic curing time period measurement device and that is heated at 180°C and a time point at which the torque of a stirring blade reaches 2.5 gf•cm during heating and stirring by using the stirring blade is not less than 300 s.

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Inventors:
SHINOMIYA KEISUKE (JP)
MORISHITA TOMOTAKA (JP)
Application Number:
PCT/JP2021/007049
Publication Date:
September 02, 2021
Filing Date:
February 25, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C08J5/18; H01L21/56; H01L21/60
Domestic Patent References:
WO2019098329A12019-05-23
WO2019189173A12019-10-03
Foreign References:
JP2010024431A2010-02-04
JP2006351790A2006-12-28
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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