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Patent Searching and Data


Title:
THERMOSETTING SILICONE COMPOSITION, SHEET, AND CURED SILICONE PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/229940
Kind Code:
A1
Abstract:
The present invention is a thermosetting silicone composition including: (A) an organopolysiloxane having average formula (1) of (SiO2)a1(R1 3SiO1/2)b1(X1O1/2)c1 (1) (50-99.9% of R1 is a methyl group, 0.1-50% of R1 is an alkenyl group, and X1 is a hydrogen atom or an alkyl group.); (B) an organopolysiloxane having average formula (2) of (SiO2)a2(R2 3SiO1/2)b2(X1O1/2)c2 (R2 is a hydrocarbon group including no alkenyl group, and X1 is a hydrogen atom or an alkyl group.); (C) an organopolysiloxane having average formula (3) of (R3 2SiO)a3(R3 3SiO1/2)b3 (20% of R3 is a methyl group, and 0.0001-25% of R3 is an alkenyl group.); (D) an organic peroxide; and (E) a solvent. According to said feature, provided is a thermosetting silicone composition which has excellent stability in an uncured state without adding a reaction control agent, and from which a cured product having a high hardness can be obtained.

Inventors:
OZAI TOSHIYUKI (JP)
OGAWA YOSHINORI (JP)
Application Number:
PCT/JP2021/013446
Publication Date:
November 18, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08F299/08; C08K3/01; C08K5/14; C08L83/04; C08L83/07
Foreign References:
JP2016108396A2016-06-20
US6342324B12002-01-29
JPH06306294A1994-11-01
JP2016124967A2016-07-11
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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