Title:
THICK FILM COOLING AND HEATING INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2021/179823
Kind Code:
A1
Abstract:
Disclosed is a thick film cooling and heating integrated circuit, comprising: a metal substrate and a vapor chamber that are arranged in a layered manner, and a thermoelectric element arranged between the metal substrate and the vapor chamber, wherein the side of the metal substrate close to the vapor chamber is provided with an integrated circuit; and the thermoelectric element is connected to a power supply. The whole thick film cooling and heating integrated circuit has few parts, and is simple and reliable; and the whole thick film cooling and heating integrated circuit uses an integrated and solid design, occupies a small space, has a high reliability, and is safe with few wires. If the area of the circuit is large, cold and heat after refrigeration are distributed quickly and uniformly. Moreover, the circuit has a high heat dissipation efficiency and a high efficiency, is convenient, and is easily developed and used.
Inventors:
TANG SIDNEY (CN)
Application Number:
PCT/CN2021/073906
Publication Date:
September 16, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
TANG SIDNEY (CN)
International Classes:
H01L35/10; H01L23/38
Foreign References:
| CN211743190U | 2020-10-23 | |||
| JPH02238232A | 1990-09-20 | |||
| CN101673780A | 2010-03-17 | |||
| CN104467536A | 2015-03-25 | |||
| CN201360012Y | 2009-12-09 | |||
| KR20060018181A | 2006-02-28 |
Attorney, Agent or Firm:
SHENZHEN JINWEI INNOVATION PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
Download PDF: