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Patent Searching and Data


Title:
THICK-FILM PASTE CONTAINING LEAD-TUNGSTEN-BASED OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES
Document Type and Number:
WIPO Patent Application WO/2016/064707
Kind Code:
A3
Abstract:
The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers and a method for doing so. The thick-film paste comprises a source of an electrically conductive metal and a lead-tungsten-based oxide dispersed in an organic medium. The invention also provides a semiconductor device comprising an electrode formed from the thick-film paste.

Inventors:
BERNARDINA KATHERINE ANNE (US)
LAUGHLIN BRIAN J (US)
VERNOOY PAUL DOUGLAS (US)
Application Number:
PCT/US2015/056162
Publication Date:
July 07, 2016
Filing Date:
October 19, 2015
Export Citation:
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Assignee:
DU PONT (US)
International Classes:
C03C3/12; C03C8/10; C03C8/18; H01B1/16; H01B1/22; H01L31/0224
Foreign References:
US20140306166A12014-10-16
Other References:
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; 3 April 1992 (1992-04-03), TANIFUJI, NOZOMI ET AL: "Copper thick-film electrically conductive paste and its electric circuit substrate", XP002752856, retrieved from STN Database accession no. 1992:142202
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; 6 January 2006 (2006-01-06), KAKUTANI, ATSUHIRO ET AL: "Manufacture of laminated dielectric devices with improved capacitance and insulation resistance", XP002752858, retrieved from STN Database accession no. 2006:11550
Attorney, Agent or Firm:
HAAS, Charles W. (Legal Patent Records Center Chestnut Run Plaza 721/2340, 974 Centre Road, PO Box 291, Wilmington Delaware, US)
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