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Patent Searching and Data


Title:
THICK POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/080598
Kind Code:
A1
Abstract:
The present invention provides a polyimide film satisfying 0.4 to 1.13 for the parameter A correlating with the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of a polyamic acid, and the thickness (T) of a polyimide film.

Inventors:
SON WON HO (KR)
JO HYONG SOP (KR)
Application Number:
PCT/KR2018/014445
Publication Date:
April 23, 2020
Filing Date:
November 22, 2018
Export Citation:
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Assignee:
SKCKOLONPI INC (KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08
Foreign References:
JP4108808B22008-06-25
KR20170049912A2017-05-11
KR101906393B12018-10-11
JP2002348388A2002-12-04
KR20020065722A2002-08-14
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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