Title:
THICKNESS MEASUREMENT DEVICE AND THICKNESS MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2020/110532
Kind Code:
A1
Abstract:
Provided are a thickness measurement device and a thickness measurement method, whereby the thickness of a layered measurement object can be detected accurately without contact even when the thickness is small. A thickness measurement device (100) is provided with a retaining conveyance mechanism part (1) and a thickness measurement mechanism part (2). The retaining conveyance mechanism part (1) includes a retaining member (11) comprising a rigid material in contact with a measurement object (9), an elastic member (12) in contact with the retaining member (11), and a joint member (10) comprising a rigid material in contact with the reverse side of the elastic member (12) from the retaining member (11). The thickness measurement mechanism part (2) includes a base member (20) comprising a rigid material which faces the retaining member (11) and is capable of clamping the measurement object (9) between the base member (20) and the retaining member (11).
Inventors:
BABA TOSHIMICHI (JP)
TOKU YUKIHIRO (JP)
YAMAI YUSAKU (JP)
TOKU YUKIHIRO (JP)
YAMAI YUSAKU (JP)
Application Number:
PCT/JP2019/041692
Publication Date:
June 04, 2020
Filing Date:
October 24, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01B11/06; B65H5/08
Foreign References:
| JP2001264044A | 2001-09-26 | |||
| JP2004055995A | 2004-02-19 | |||
| JPS5387258A | 1978-08-01 | |||
| JP2003294419A | 2003-10-15 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: