Title:
THIN ALLOY FILM EXHIBITING LOW THERMAL EXPANSION AND METHOD FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/070996
Kind Code:
A1
Abstract:
A low thermal expansion thin alloy film which substantially has a chemical composition, in mass %: Ni: 30 to 34 %, Co: 2 to 6 %, Mn: 0.6 % or less, Al: 0.1 % or less, C: 0.02 % or less, Si: 0.3 % or less, P: 0.01 % or less, s: 0.005 % or less, N: 0.01 % or less, and balance: Fe, and exhibits an integration degree for (200)plane of 50 % or more and an integration degree for (220)plane of 20 % or less. The low thermal expansion thin alloy film exhibits not only high etching speed, but also excellent dimensional precision of etching, and thus can be advantageously used for a shadow mask of a cathode-ray tube.
Inventors:
KOBAYASHI AKIO (JP)
FUJITA KOICHIRO (JP)
YAMAUCHI KATSUHISA (JP)
ARIGA TAMAKO (JP)
TOMITA KUNIKAZU (JP)
MURATA SAIICHI (JP)
FUJITA KOICHIRO (JP)
YAMAUCHI KATSUHISA (JP)
ARIGA TAMAKO (JP)
TOMITA KUNIKAZU (JP)
MURATA SAIICHI (JP)
Application Number:
PCT/JP2003/001754
Publication Date:
August 28, 2003
Filing Date:
February 19, 2003
Export Citation:
Assignee:
JFE STEEL CORP (JP)
KOBAYASHI AKIO (JP)
FUJITA KOICHIRO (JP)
YAMAUCHI KATSUHISA (JP)
ARIGA TAMAKO (JP)
TOMITA KUNIKAZU (JP)
MURATA SAIICHI (JP)
KOBAYASHI AKIO (JP)
FUJITA KOICHIRO (JP)
YAMAUCHI KATSUHISA (JP)
ARIGA TAMAKO (JP)
TOMITA KUNIKAZU (JP)
MURATA SAIICHI (JP)
International Classes:
B21B3/02; B21B3/00; C21D9/46; C22C38/00; C22C38/02; C22C38/04; C22C38/06; C22C38/08; C22C38/10; H01J9/14; H01J29/07; (IPC1-7): C22C38/00; B21B3/00; C21D9/46; C22C38/10; H01J29/07
Foreign References:
| US5396146A | 1995-03-07 | |||
| JPH09157799A | 1997-06-17 | |||
| JPH03158438A | 1991-07-08 |
Attorney, Agent or Firm:
Ochiai, Kenichiro c/o Intellectual Property Department JFE Steel Corporation 2-3 (Uchisaiwai-cho 2-chome Chiyoda-ku Tokyo, Tokyo, JP)
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