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Patent Searching and Data


Title:
THIN FILM COMPOUNDING APPARATUS AND COMPOUNDING PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/019769
Kind Code:
A1
Abstract:
The present application discloses a thin film compounding apparatus and a compounding process thereof. The thin film compounding apparatus comprises a first unwinding device, a second unwinding device, a gluing device, a laminating device, a UV curing device, and a winding device which are sequentially arranged. A first film layer is sequentially wound on the first unwinding device, a second film layer is wound on the second unwinding device and the gluing device, and a composite film is sequentially wound on the laminating device, the UV curing device, and the winding device. The UV curing device comprises a flattening roller, a first guide roller, and a UV lamp, the flattening roller is located on the front side of the first guide roller, and the UV lamp directly faces the first guide roller. A thin film prepared using the thin film compounding device provided in the present invention has no stretch, bubbles and wrinkles can be flattened and eliminated in the process, and the present application can be applied to compounding of a digital printing film and a wear-resistant layer.

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Inventors:
DAI HUIBIN (CN)
DONG LIJIE (CN)
CHEN JIAJIE (CN)
ZHANG ZHONGFEI (CN)
Application Number:
PCT/CN2021/130397
Publication Date:
February 23, 2023
Filing Date:
November 12, 2021
Export Citation:
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Assignee:
ZHEJIANG KINGDOM NEW MAT GROUP CO LTD (CN)
International Classes:
B32B37/10; B32B37/00; B32B37/12; B32B38/00
Foreign References:
CN113619251A2021-11-09
CN215882930U2022-02-22
CN210679989U2020-06-05
CN211569575U2020-09-25
CN203974193U2014-12-03
US20090188612A12009-07-30
Attorney, Agent or Firm:
HANGZHOU YUYANG UNIONPATENT AGENCY CO., LTD. (CN)
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