Title:
THIN FILM DEPOSITION METHOD AND DEPOSITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/178193
Kind Code:
A1
Abstract:
Provided is a method for low-cost deposition of a durable thin film. This deposition device (1) includes a vacuum chamber (11) in which a substrate (100) is arranged at the bottom, a vacuum pump (15) which evacuates the chamber (11), a storage container (23) which is provided outside of the chamber (11) and which stores a film deposition solution (21), a nozzle (17) which at one end has a discharge unit (19) which can discharge the film deposition solution (21), and a pressurizing means (a gas supply source (29), etc.) which pressurizes the liquid surface of the film deposition solution (21) stored in the storage container (23). As the film deposition solution (21), a solution is used which is made up of two or more materials, including a first material (S1) and a second material (S2) having a vapor pressure (P2) higher than the vapor pressure (P1) of the first material (S1), with the concentration of the first material being 0.01 wt% or greater. The film deposition solution (21) is discharged onto the substrate with a discharge pressure of 0.05-0.3MPa in an environment at a pressure of P2 or greater (but not a pressure more than one order of magnitude higher than P2).
Inventors:
SAMORI SHINGO (JP)
TAKASE SHINICHI (JP)
SUGAWARA SATOSHI (JP)
NAGAE EKISHU (JP)
JIANG YOUSONG (JP)
TAKASE SHINICHI (JP)
SUGAWARA SATOSHI (JP)
NAGAE EKISHU (JP)
JIANG YOUSONG (JP)
Application Number:
PCT/JP2015/063081
Publication Date:
November 26, 2015
Filing Date:
May 01, 2015
Export Citation:
Assignee:
SHINCRON CO LTD (JP)
International Classes:
B05C9/10; B05D3/12
Foreign References:
| JP2004087465A | 2004-03-18 | |||
| JPH02297952A | 1990-12-10 | |||
| JPH1097104A | 1998-04-14 |
Attorney, Agent or Firm:
OHKURA, Koichiro et al. (JP)
Koichiro Okura (JP)
Koichiro Okura (JP)
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