Title:
THIN FILM, DIGITAL MICROFLUIDIC CHIP SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/032791
Kind Code:
A1
Abstract:
A thin film, a digital microfluidic chip substrate and a preparation method therefor. The thin film (3) is a dielectric and hydrophobic thin film, one surface of the dielectric and hydrophobic thin film being a hydrophilic surface, and the other surface of the dielectric and hydrophobic thin film being a hydrophobic surface. The thin film (3) has both dielectric and hydrophobic functions, thus radically overcoming the irreversible damage to traditional digital microfluidic chips caused by hydrophobic layers thereof falling off from dielectric layers, and greatly simplifying the preparation process for dielectric and hydrophobic layers. Meanwhile, the dielectric and hydrophobic thin film has the hydrophilic surface, and after the hydrophilic surface is combined with an adhesive (2), the thin film can be firmly affixed to the upper surface of a circuit substrate (1), and the thin film is resistant to high temperature and does not easily fall off from the circuit substrate (1), thereby widening the use scenarios of a chip, and prolonging the service life of the chip.
Inventors:
SU YANG (CN)
Application Number:
PCT/CN2023/112714
Publication Date:
February 15, 2024
Filing Date:
August 11, 2023
Export Citation:
Assignee:
JIANGSU LOGILET BIOTECH CO LTD (CN)
International Classes:
B01L3/00
Foreign References:
| CN104438021A | 2015-03-25 | |||
| CN114308152A | 2022-04-12 | |||
| CN104907238A | 2015-09-16 | |||
| CN109647549A | 2019-04-19 | |||
| CN108465493A | 2018-08-31 | |||
| CN215140009U | 2021-12-14 | |||
| US20200070171A1 | 2020-03-05 | |||
| US20210237081A1 | 2021-08-05 |
Attorney, Agent or Firm:
BEIJING HAN KUN LAW OFFICES (CN)
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