Title:
THIN FILM LC COMPONENT AND MOUNTING STRUCTURE OF SAME
Document Type and Number:
WIPO Patent Application WO/2017/057422
Kind Code:
A1
Abstract:
This thin film LC component (101) comprises: a substrate (10) that has a first surface (S1) and a second surface (S2) facing each other; a thin film capacitor (TFC) that is formed on the first surface (S1) by a thin film process; a thin film inductor (TFL) that is formed in a region of the second surface (S2) by a thin film process, said region at least partially overlapping the thin film capacitor (TFC) when viewed in plan; interlayer connection conductors (42, 62) that are formed in the substrate (10) and connect the thin film capacitor (TFC) and the thin film inductor (TFL) to each other; an insulating layer (31) that is formed on the first surface (S1) and covers the thin film capacitor (TFC); and a plurality of terminal electrodes (51, 52, 53) that are formed on the surface of the insulating layer (31) and are connected to the thin film capacitor (TFC) and the thin film inductor (TFL).
Inventors:
UEKI NORIYUKI (JP)
Application Number:
PCT/JP2016/078552
Publication Date:
April 06, 2017
Filing Date:
September 28, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/40; H01F17/00; H01F27/00; H01G4/33; H03H7/01
Domestic Patent References:
| WO2010016171A1 | 2010-02-11 |
Foreign References:
| JPH11195531A | 1999-07-21 | |||
| JP2004128219A | 2004-04-22 | |||
| JPH1098269A | 1998-04-14 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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