Title:
THIN FILM LED DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/000276
Kind Code:
A1
Abstract:
A thin film LED device and manufacturing method thereof are provided. The LED device comprises a slice-type circuit board (1), a flip structure LED chip (2) without gold wires and a light transmission protecting film (3). Chip electrodes (21, 22) of the LED chip (2) are fixed on the slice-type board by eutectic welding way. An electric connection without gold wire bonding is achieved. The light transmission protecting film (3) covers on the surface of the chip (2) and the circuit board (1). Electrodes of the LED device are positioned at the bottom of the device for realizing the surface mount technology easily. The thickness of the LED device is between 0.25-0.6 mm. The LED device has the advantages of thin thickness, small size, large light-emitting angle, high light efficiency, high reliability, simple manufacturing process, low cost and the like, is suitable for high-power and common-power LED packaging, and can be widely applied in the fields of illumination, display and the like.
Inventors:
TANG YONG (CN)
YU BINHAI (CN)
LI ZONGTAO (CN)
DING XINRUI (CN)
LU LONGSHENG (CN)
YUAN WEI (CN)
WAN ZHENPING (CN)
YU BINHAI (CN)
LI ZONGTAO (CN)
DING XINRUI (CN)
LU LONGSHENG (CN)
YUAN WEI (CN)
WAN ZHENPING (CN)
Application Number:
PCT/CN2013/089719
Publication Date:
January 08, 2015
Filing Date:
December 17, 2013
Export Citation:
Assignee:
UNIV SOUTH CHINA TECH (CN)
International Classes:
H01L33/52; H01L33/48
Foreign References:
| CN103367605A | 2013-10-23 | |||
| CN203339218U | 2013-12-11 | |||
| CN101300687A | 2008-11-05 | |||
| CN102270730A | 2011-12-07 | |||
| JP2011138831A | 2011-07-14 | |||
| CN103165766A | 2013-06-19 | |||
| CN102280562A | 2011-12-14 |
Attorney, Agent or Firm:
YOGO PATENT & TRADEMARK AGENCY LIMITED COMPANY (CN)
广州粤高专利商标代理有限公司 (CN)
广州粤高专利商标代理有限公司 (CN)
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