Title:
THIN-FILM TYPE STRETCHABLE ELECTRONICS INCLUDING STRETCHABLE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/075201
Kind Code:
A1
Abstract:
The present invention relates to thin-film type stretchable electronics including a stretchable substrate, and a manufacturing method therefor. The present invention provides thin-film type stretchable electronics in which, by the surface treatment of a stretchable substrate, surface roughness and the work of adhesion (Wa, mJ/㎡) between the surface-treated substrate and an adjacent layer are optimized so that, through interaction between device constituent layers even in tensile strain conditions, the work of adhesion between the layers is enhanced, thus implementing high mechanical stretchability to prevent damage of the device constituent layers. The thin-film type stretchable electronics are useful for application to wearable electronic devices.
Inventors:
LEE JUNG YONG (KR)
JEON YEON JEE (KR)
LEE SEUNG BOK (KR)
JEON YEON JEE (KR)
LEE SEUNG BOK (KR)
Application Number:
PCT/KR2022/015255
Publication Date:
May 04, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
H01L31/0392; C08L9/06; C08L53/02; H01L31/18
Domestic Patent References:
| WO2018081705A1 | 2018-05-03 |
Foreign References:
| KR101899253B1 | 2018-10-31 | |||
| EP3200195A1 | 2017-08-02 | |||
| KR20210128905A | 2021-10-27 | |||
| KR102293405B1 | 2021-08-26 | |||
| KR102379648B1 | 2022-03-29 |
Attorney, Agent or Firm:
EO PATENT LAW FIRM (KR)
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