THIN HEAT PIPE, METHOD FOR MANUFACTURING THIN HEAT PIPE, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2020/119436

A1

The present application provides a thin heat pipe, a method for manufacturing the thin heat pipe, and an electronic device. The thin heat pipe comprises a pipe body having a cavity. Two ends of the pipe body comprise a tapered portion. A cross-sectional area of the cavity in the tapered portion gradually decreases in a direction away from the center of the pipe body. An airtight seal is formed at the ends of the pipe body. A wick structure and working substance are provided in the cavity. Thus, the entire interior of the pipe body of the thin heat pipe is a cavity. Compared with other heat pipes having a tapered pipe structure, assuming the same length of pipe body, the cavity of the invention is larger and longer, allowing more wick structures and working substance to be accommodated. In addition, a longer circulation distance of the working substance improves the condensation effect thereof, the heat conduction capability of the heat pipe, and the heat dissipation performance of the thin heat pipe. When the thin heat pipe of the present application is applied to heat dissipation designs of chips of electronic products such as mobile phones and tablets, a chip temperature is effectively reduced, and frequency reduction of chips at a high temperature is avoided, thereby fully exerting chip performance.

ZHANG JUN (CN)
LIU YONGLU (CN)
JIN LINFANG (CN)
YUAN ZHI (CN)
YANG GUO (CN)

PCT/CN2019/120775

June 18, 2020

November 26, 2019

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HUAWEI TECH CO LTD (CN)

F28D15/04

WO2011010395A1

2011-01-27

CN109631636A	2019-04-16
CN105698579A	2016-06-22
CN105698579A	2016-06-22
CN1967130A	2007-05-23
CN103851941A	2014-06-11

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