Title:
THINNER COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THINNER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/014331
Kind Code:
A1
Abstract:
The present invention provides a thinner composition containing a solvent (B) that includes a compound (B1) represented by general formula (b-1) below. (In formula (b-1) above, R0 is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)
Inventors:
OKADA TAKUMI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2023/024545
Publication Date:
January 18, 2024
Filing Date:
July 03, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/42; G03F7/004; G03F7/039; H01L21/027
Foreign References:
| JPS62123444A | 1987-06-04 | |||
| JP2007304490A | 2007-11-22 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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