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Title:
THIXOTROPIC SILICONE GEL COMPOSITION FOR SPOT POTTING, CURED PRODUCT THEREOF, AND PHOTOCOUPLER
Document Type and Number:
WIPO Patent Application WO/2023/136188
Kind Code:
A1
Abstract:
Provided is a silicone gel composition which contains, as a base polymer, a silicon-bonded alkenyl group-containing straight-chain or branched-chain organopolysiloxane containing a specific amount of a diphenylsiloxane unit in the molecule, and contains a specific blending amount of a cross-linking agent having a specific molecular structure, a platinum-based curing catalyst, a hydrophobized fine silica powder, and an isocyanuric acid derivative having a specific molecular structure having at least two trialkoxysilyl-substituted alkyl groups in the molecule, wherein the curing of the silicone gel composition gives a silicone gel cured product having a penetration of 10-100 as specified in JIS K6249. Since the silicone gel composition exhibits little spread when applied to substrates of various electronic boards such as control circuit boards, little change in shape before and after thermal curing, and little change in the penetration of the cured product under high temperature conditions, a specific semiconductor element such as a photocoupler mounted on a control board can be exclusively coated (so-called spot potting) and the element and the like can be sealed in a desired shape. Thus, the silicone gel composition is useful as a silicone gel composition for sealing a photocoupler and the like.

Inventors:
MATSUDA TSUYOSHI (JP)
Application Number:
PCT/JP2023/000036
Publication Date:
July 20, 2023
Filing Date:
January 05, 2023
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L31/12; C08K5/544; C08K9/06; C08L83/05; C08L83/07; H01L23/29
Domestic Patent References:
WO2020026760A12020-02-06
Foreign References:
JP2018053015A2018-04-05
JPH1129710A1999-02-02
JP2012233035A2012-11-29
JP2000297215A2000-10-24
JP2017147371A2017-08-24
CN103013433A2013-04-03
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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