Title:
THREE-DIMENSIONAL MEMORY DEVICES WITH SUPPORT STRUCTURES AND METHODS FOR FORMING THE SAME
Document Type and Number:
WIPO Patent Application WO/2022/099582
Kind Code:
A1
Abstract:
A 3D memory device includes a memory stack and a support structure. The memory stack, on a substrate, includes a core region and a non-core region neighboring the core region. The support structure extends in the non-core region and into the substrate. The support structure includes a first support portion and a second support portion over the first support portion. The first support portion has a stiffness higher than the second support portion.
Inventors:
ZHANG ZHONG (CN)
HAN YUHUI (CN)
ZHOU WENXI (CN)
HAN YUHUI (CN)
ZHOU WENXI (CN)
Application Number:
PCT/CN2020/128553
Publication Date:
May 19, 2022
Filing Date:
November 13, 2020
Export Citation:
Assignee:
YANGTZE MEMORY TECH CO LTD (CN)
International Classes:
H01L27/11582; H01L27/1157
Foreign References:
| CN111554685A | 2020-08-18 | |||
| US20180130812A1 | 2018-05-10 | |||
| CN110911413A | 2020-03-24 |
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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