Title:
THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/188336
Kind Code:
A1
Abstract:
Provided is a three-dimensional molded circuit component that has high heat dissipation properties and that also has high producibility and is easily molded. A three-dimensional molded circuit component that has: a base material that includes a metal part and a resin part; a circuit pattern that is formed upon the resin part; and a mounted component that is mounted upon the base material and that is electrically connected to the circuit pattern. One portion of the resin part is a resin thin film that is 0.01-0.5 mm thick, includes a thermoplastic resin, and is formed upon the metal part. The mounted component is arranged upon the metal part with the resin thin film therebetween.
Inventors:
YUSA ATSUSHI (JP)
YAMAMOTO SATOSHI (JP)
KITO AKIKO (JP)
OTA HIRONORI (JP)
GOTO HIDETO (JP)
USUKI NAOKI (JP)
YAMAMOTO SATOSHI (JP)
KITO AKIKO (JP)
OTA HIRONORI (JP)
GOTO HIDETO (JP)
USUKI NAOKI (JP)
Application Number:
PCT/JP2017/016594
Publication Date:
November 02, 2017
Filing Date:
April 26, 2017
Export Citation:
Assignee:
HITACHI MAXELL (JP)
International Classes:
H05K1/02; B29C45/14; B29C45/26; H01L33/64; H05K1/05; B29L31/34
Foreign References:
| JP2003234557A | 2003-08-22 | |||
| JPH0786445A | 1995-03-31 | |||
| JP2002185099A | 2002-06-28 | |||
| JPH06334338A | 1994-12-02 | |||
| JP2007281189A | 2007-10-25 | |||
| JPS6358986A | 1988-03-14 | |||
| JPH0614579B2 | 1994-02-23 | |||
| JP2013084822A | 2013-05-09 |
Other References:
See also references of EP 3451802A4
Attorney, Agent or Firm:
KAWAKITA, Kijuro et al. (JP)
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