Title:
THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD FOR MANUFACTURING THROUGH-HOLE ELECTRODE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/096131
Kind Code:
A1
Abstract:
This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second surface; a metal layer including at least a hole metal layer positioned at the through-hole; and an adhesion layer positioned between the substrate and the metal layer and including a metal oxide. The through-hole has a side wall reaching from the first surface to the second surface. The side wall includes a first end connected to the first surface and a second end connected to the second surface. The adhesion layer includes a hole adhesion layer that is positioned between the side wall and a through-hole electrode so as to extend from the first end of the side wall to the second end thereof.
Inventors:
SUZUKI MIYUKI (JP)
MORII AKIO (JP)
YOSHII YUMI (JP)
ARAI JUNKO (JP)
TSUNODA TSUYOSHI (JP)
FUJIMOTO KOJI (JP)
MORII AKIO (JP)
YOSHII YUMI (JP)
ARAI JUNKO (JP)
TSUNODA TSUYOSHI (JP)
FUJIMOTO KOJI (JP)
Application Number:
PCT/JP2023/039769
Publication Date:
May 10, 2024
Filing Date:
November 02, 2023
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K1/11; H01G4/10; H01G4/33; H01L23/12; H01L23/15; H05K3/14; H05K3/18; H05K3/40
Foreign References:
| JP2022147360A | 2022-10-06 | |||
| JP2018074134A | 2018-05-10 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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