Title:
TIN ALLOY PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2018/142776
Kind Code:
A1
Abstract:
A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal more precious than tin, and a sulfide compound represented by general formula (1). In formula (1), n is 1 to 3. The metal more precious than tin is preferably silver, copper, gold, or bismuth.
Inventors:
TATSUMI KOUJI (JP)
YASOSHIMA TSUKASA (JP)
KATASE TAKUMA (JP)
YASOSHIMA TSUKASA (JP)
KATASE TAKUMA (JP)
Application Number:
PCT/JP2017/044668
Publication Date:
August 09, 2018
Filing Date:
December 13, 2017
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/56; C25D3/60
Foreign References:
| JP2006265572A | 2006-10-05 | |||
| JP2016183409A | 2016-10-20 | |||
| JP2001164396A | 2001-06-19 | |||
| JP15219A | ||||
| JP2017015219A | 2017-01-19 | |||
| JP222433A | ||||
| JP2017222433A | 2017-12-21 | |||
| JPH11269691A | 1999-10-05 | |||
| JP2000192279A | 2000-07-11 | |||
| JP2006265572A | 2006-10-05 | |||
| JP2007046142A | 2007-02-22 |
Other References:
See also references of EP 3578692A4
Attorney, Agent or Firm:
SUDA, Masayoshi (JP)
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