TIN-PLATED COPPER ALLOY TERMINAL MEMBER WITH OUTSTANDING INSERTION AND REMOVAL CHARACTERISTICS

Title:

TIN-PLATED COPPER ALLOY TERMINAL MEMBER WITH OUTSTANDING INSERTION AND REMOVAL CHARACTERISTICS

Document Type and Number:

WIPO Patent Application WO/2013/024814

Kind Code:

A1

Abstract:

Provided is a tin-plated copper alloy terminal member with outstanding insertion and removal characteristics and that demonstrates outstanding electrical connection properties while a coefficient of kinetic friction is reduced to 0.3 or less. The tin-plated copper alloy terminal member comprises a tin-based surface layer formed on a surface of a substrate made of a copper alloy, and a copper-tin alloy layer formed between the tin-based surface layer and the substrate. The copper-tin alloy layer is an alloy layer having Cu6Sn5 as the primary component thereof, with compounds in which part of the copper in the Cu6Sn5 has been substituted with nickel or silicon being present near the interface on the substrate side. The average thickness of the tin-based surface layer is between 0.2 µm and 0.6 µm. The oil retention depth (Rvk) of the copper-tin alloy layer is at least 0.2 µm. The proportion of the area of the copper-tin alloy layer exposed to the surface of the tin-based surface layer is between 10% and 40%. The coefficient of kinetic friction is 0.3 or less.

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Inventors:

TANINOUCHI YUKI (JP)
KATO NAOKI (JP)
KUBOTA KENJI (JP)

Application Number:

PCT/JP2012/070485

Publication Date:

February 21, 2013

Filing Date:

August 10, 2012

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)
TANINOUCHI YUKI (JP)
KATO NAOKI (JP)
KUBOTA KENJI (JP)

International Classes:

C25D7/00; C25D5/10; C25D5/50; H01R13/03

Foreign References:

JP2007100220A	2007-04-19
JP2007063624A	2007-03-15
JP2011204617A	2011-10-13
JP2007100220A	2007-04-19
JP2007063624A	2007-03-15

Other References: