TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND POWER CABLE TERMINAL STRUCTURE

Title:

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND POWER CABLE TERMINAL STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/212174

Kind Code:

A1

Abstract:

Provided is a tin-plated copper terminal material having: a substrate of copper or copper alloy; an intermediate zinc layer of zinc alloy that is formed on top of the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer of tin or tin alloy that is formed on top of the intermediate zinc layer and in which the proportion of the length occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed. Also provided are a terminal comprising said terminal material, and a power cable terminal structure using said terminal.

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Inventors:

KUBOTA KENJI (JP)
TARUTANI YOSHIE (JP)
NAKAYA KIYOTAKA (JP)

Application Number:

PCT/JP2018/018747

Publication Date:

November 22, 2018

Filing Date:

May 15, 2018

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

C25D7/00; C22C18/00; C25D5/10; C25D5/12; C25D5/50; H01R4/18; H01R4/62; H01R13/03

Foreign References:

JP2011219822A	2011-11-04
JP2016169439A	2016-09-23
JP2010010013A	2010-01-14
JP2016518528A	2016-06-23
JP2017096979A	2017-06-01
JP2013218866A	2013-10-24
JP2015133306A	2015-07-23
JP2008285729A	2008-11-27

Other References: