TIN-ZINC LEAD-FREE SOLDER AND SOLDER-JOINED PART

Title:

TIN-ZINC LEAD-FREE SOLDER AND SOLDER-JOINED PART

Document Type and Number:

WIPO Patent Application WO/2004/018146

Kind Code:

A1

Abstract:

A tin-zinc lead-free solder contains tin as a main component, at least 6-10 weight% of zinc essentially, 0.0015 to 0.03 weight% of magnesium, and 0.0010 to 0.006 weight% of aluminum. When a paste of the solder is stored in a cooled state or even at temperatures above the room temperature, the oxide protective film formed from magnesium and aluminum on solder particles protects the inside, the shelf life is prolonged by suppressing the reaction between the zinc and an activator, a favorable wettability can be maintained because the oxide protective film is subject to breakage when the solder is heated and melted.

Inventors:

YOSHIKAWA MASAAKI (JP)
AOYAMA HARUO (JP)
TANAKA HIROTAKA (JP)

Application Number:

PCT/JP2002/011989

Publication Date:

March 04, 2004

Filing Date:

November 18, 2002

Export Citation:

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Assignee:

NIPPON METAL IND (JP)
YOSHIKAWA MASAAKI (JP)
AOYAMA HARUO (JP)
TANAKA HIROTAKA (JP)

International Classes:

B23K35/02; B23K35/26; B23K35/36; C22C13/00; H05K3/34; (IPC1-7): B23K35/26

Foreign References:

JP2000015478A	2000-01-18
JP2000210788A	2000-08-02
JP2002248596A	2002-09-03
JP2002283093A	2002-10-02

Other References: