Title:
TIP OF SOLDERING IRON, PROCESS FOR PRODUCING THE SAME, AND ELECTRICAL SOLDERING IRON AND ELECTRICAL SOLDER SUCKING IRON INCLUDING THE IRON TIP
Document Type and Number:
WIPO Patent Application WO/2004/048024
Kind Code:
A1
Abstract:
Iron tip (2) for soldering for use as the tip of an electrical soldering iron (copper) or electrical solder sucking iron (copper), comprising tip core material (10) of copper or copper alloy having its front end fitted with iron forefront member (20) constituted of a metal particle sintering compact produced according to the powder metallurgical process. In the metal particle sintering compact, use is made of a sintering base material consisting of an appropriate combination of the respective particles of iron, nickel and cobalt optionally together with a first sintering auxiliary material consisting of an appropriate combination of the respective particles of copper, silver, tin, boron and carbon and a second sintering auxiliary material consisting of an appropriate combination of the respective particles of vanadium, niobium, tantalum, chromium and molybdenum.
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Inventors:
NAGASE TAKASHI
UETANI TAKASHI
TERAOKA YOSHITOMO
UETANI TAKASHI
TERAOKA YOSHITOMO
Application Number:
PCT/JP2003/014958
Publication Date:
June 10, 2004
Filing Date:
November 25, 2003
Export Citation:
Assignee:
HAKKO CORP (JP)
International Classes:
B22F7/06; B22F7/08; B23K3/02; B23K3/03; C22C38/00; C22C38/08; C22C38/10; C22C38/16; B23K35/30; (IPC1-7): B23K3/02; B22F7/06
Domestic Patent References:
| WO1998034748A2 | 1998-08-13 |
Foreign References:
| JPS54161509A | 1979-12-21 |
Other References:
See also references of EP 1586402A4
Attorney, Agent or Firm:
Kotani, Etsuji (2-2 Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka, JP)
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