Title:
TITANIUM SPUTTERING TARGET AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2016/047572
Kind Code:
A1
Abstract:
Conventional concave (recessed) titanium sputtering targets are manufactured by grinding down a titanium rolled sheet, but poor film thickness uniformity during deposition by sputtering was a problem since the crystalline orientation of a flat surface part and a tapered part differ greatly. The invention of the present application provides a titanium sputtering target with excellent characteristics that is processed into a concave shape (recessed shape) using a press (forge), instead of grinding down a titanium rolled sheet, and by doing so the difference in the crystalline orientation between the flat surface part and the tapered part is reduced. By doing so, the present invention makes it possible to form a thin film with excellent homogeneity (uniformity) without changing conventional sputtering characteristics, and also has the beneficial effect of enabling the increase of yield and reliability of semiconductor products for which miniaturization and high integration are advancing.
Inventors:
TSUKAMOTO SHIRO (JP)
Application Number:
PCT/JP2015/076616
Publication Date:
March 31, 2016
Filing Date:
September 18, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C14/34; H01L21/285
Domestic Patent References:
| WO2014136702A1 | 2014-09-12 |
Foreign References:
| JPH09272965A | 1997-10-21 | |||
| JP2003226969A | 2003-08-15 | |||
| JP2000265270A | 2000-09-26 | |||
| JPS61183467A | 1986-08-16 | |||
| JPH05287524A | 1993-11-02 |
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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