Title:
TITANIUM SPUTTERING TARGET, PRODUCTION METHOD THEREFOR, AND METHOD FOR PRODUCING TITANIUM-CONTAINING THIN FILM
Document Type and Number:
WIPO Patent Application WO/2019/058721
Kind Code:
A1
Abstract:
Provided is a titanium sputtering target having a recrystallized structure with an average crystal grain size of 1 µm or less. Also provided is a production method for a titanium sputtering target comprising: a step for large strain processing of cut titanium ingots to obtain processed sheets; a step for cold rolling said processed sheets at a reduction of at least 30%; and a step for heat-treating said rolled sheets at a temperature of 320°C or less.
Inventors:
MURATA SHUHEI (JP)
SHONO DAIKI (JP)
SHONO DAIKI (JP)
Application Number:
PCT/JP2018/026595
Publication Date:
March 28, 2019
Filing Date:
July 13, 2018
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C14/34; C22F1/18; C22C14/00; C22F1/00
Domestic Patent References:
| WO2005080623A1 | 2005-09-01 | |||
| WO2014038487A1 | 2014-03-13 |
Foreign References:
| JPH08333676A | 1996-12-17 | |||
| JPH1150244A | 1999-02-23 | |||
| JP2016145384A | 2016-08-12 | |||
| JP6077102B2 | 2017-02-08 |
Other References:
See also references of EP 3686313A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
Download PDF: