Title:
TOOL FOR CONFIRMING JETTING SOLDER HEIGHT, AND METHOD FOR HANDLING SAID TOOL
Document Type and Number:
WIPO Patent Application WO/2019/107349
Kind Code:
A1
Abstract:
Provided are a tool for confirming jetting solder height, and a method for handling said tool, with which it is possible to precisely adjust the height of a jetting wave of molten solder. A tool 400 for confirming jetting solder height is provided with: a height confirmation unit 10 for confirming the height of a jetting wave of molten solder 7; a holding unit 20 that holds the height confirmation unit 10; a reporting unit 30 that reports the height of the jetting wave of molten solder; and a bridge member 40 having a length that enables bridging of an upper part of a jetting solder tank 55 accommodated within a casing 501, the bridge member 40 supporting the height confirmation unit 10 at the upper part of the jetting solder tank 55. The reporting unit 30 is connected to a power supply unit 510 of a jetted soldering device 500.
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Inventors:
SUZUKI RYOICHI (JP)
KAWASHIMA YASUJI (JP)
KOMINE SHIGEO (JP)
SUGIHARA TAKASHI (JP)
INOUE HIROYUKI (JP)
KAWASHIMA YASUJI (JP)
KOMINE SHIGEO (JP)
SUGIHARA TAKASHI (JP)
INOUE HIROYUKI (JP)
Application Number:
PCT/JP2018/043556
Publication Date:
June 06, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K1/08; B23K1/00; H05K3/34
Foreign References:
| JPS6225825U | 1987-02-17 | |||
| JPS6244223U | 1987-03-17 | |||
| JPH08243732A | 1996-09-24 | |||
| JPH026163U | 1990-01-16 | |||
| JPS5426067U | 1979-02-20 | |||
| JP5288012B2 | 2013-09-11 | |||
| JP2011189395A | 2011-09-29 | |||
| JPS4867026U | 1973-08-25 |
Other References:
See also references of EP 3718668A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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