Title:
TOP RING AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080189
Kind Code:
A1
Abstract:
Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.
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Inventors:
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2023/036057
Publication Date:
April 18, 2024
Filing Date:
October 03, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/30; B24B49/10; H01L21/304
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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