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Patent Searching and Data


Title:
TOUCH PANEL, RADIATION-SENSITIVE RESIN COMPOSITION AND CURED FILM
Document Type and Number:
WIPO Patent Application WO/2015/046261
Kind Code:
A1
Abstract:
Provided is a highly reliable touch panel having a metal wiring line and a cured film covering the metal wiring line. Also provided are the cured film and a radiation-sensitive resin composition for forming the cured film. A radiation-sensitive resin composition for forming a cured film (25) of a touch panel (21) is prepared so as to contain (A) a sensitizing agent and (B) an alkoxy silyl group-containing compound and/or a hydrolysis-condensation product of the compound. A touch panel (21) is provided by forming a cured film (25), with use of this radiation-sensitive resin composition, on a transparent substrate (22) on which a first detection electrode (23), a second detection electrode (24) and a wiring line (31) having a first layer containing copper and a second layer that is configured to cover at least a part of the first layer and to contain an oxide of a second metal element other than copper are arranged.

Inventors:
HONDA AKIHISA (JP)
OKUDA TSUTOMU (JP)
ISHIKAWA HIROKI (JP)
SAKAI TAKAHIRO (JP)
ICHINOHE DAIGO (JP)
Application Number:
PCT/JP2014/075310
Publication Date:
April 02, 2015
Filing Date:
September 24, 2014
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G06F3/041; C08F2/44; G03F7/004; G03F7/027; G03F7/032
Domestic Patent References:
WO2008069159A12008-06-12
WO2006025347A12006-03-09
Foreign References:
JP2013140229A2013-07-18
JPH0697164A1994-04-08
JP2010256826A2010-11-11
Attorney, Agent or Firm:
OOAKU, Atsuko (JP)
Atsuko Oaku (JP)
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