Title:
TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/155035
Kind Code:
A1
Abstract:
Disclosed is a transfer device (1) that transfers a pattern formed on a mold (200) to an object to which the pattern is to be transferred (300). The transfer device comprises a first stage (150a), a second stage (150b), a plurality of shafts (101a to 101d) provided between the first stage and the second stage, and first clamps (153a) provided on the first stage and that grip the mold. The first clamps are positioned outside a predetermined region that connects a central region of a pressurizing surface, which is the central region of the pressurizing surface of the mold during transfer, and the shafts. This configuration enables the stress to be concentrated locally inside the mold during pattern transfer, which suitably prevents mold damage.
Inventors:
IMAI TETSUYA (JP)
KOJIMA YOSHIAKI (JP)
KASUYA TAKAYUKI (JP)
KOJIMA YOSHIAKI (JP)
KASUYA TAKAYUKI (JP)
Application Number:
PCT/JP2010/059782
Publication Date:
December 15, 2011
Filing Date:
June 09, 2010
Export Citation:
Assignee:
PIONEER CORP (JP)
IMAI TETSUYA (JP)
KOJIMA YOSHIAKI (JP)
KASUYA TAKAYUKI (JP)
IMAI TETSUYA (JP)
KOJIMA YOSHIAKI (JP)
KASUYA TAKAYUKI (JP)
International Classes:
B29C59/02; B29C33/30; G11B7/26; H01L21/027; G11B5/84
Domestic Patent References:
| WO2010061459A1 | 2010-06-03 | |||
| WO2010061462A1 | 2010-06-03 |
Foreign References:
| JP2008230027A | 2008-10-02 | |||
| JPS59124654U | 1984-08-22 |
Attorney, Agent or Firm:
EGAMI, Tatsuo et al. (JP)
Tatsuo Egami (JP)
Tatsuo Egami (JP)
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Claims: