Title:
TRANSFER FILM, METHOD FOR MANUFACTURING LAMINATE, LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/024783
Kind Code:
A1
Abstract:
A first problem addressed by the present invention is to provide a transfer film in which step coverage is excellent when adhered to an adherend after storage, the peeling properties of a temporary carrier are excellent, and the linear expansion coefficient of a cured product of a photosensitive layer is low. A second problem addressed by the present invention is to provide a laminate, a method for manufacturing a laminate, and a method for manufacturing a semiconductor package. A transfer film according to the present invention has a temporary carrier and a photosensitive layer disposed on the temporary carrier, wherein: the photosensitive layer includes a resin X selected from the group consisting of polyimides, polybenzoxazoles, and precursors thereof, a photopolymerization initiator, and a compound Y which is different from the photopolymerization initiator; the compound Y has a molecular weight of 200-1000 and a boiling point of 230-500°C; the mass ratio of the content of the compound Y to the content of the resin X is 0.40-1.50; and if the compound Y is a polymerizable compound, the polymerizable compound has a methacryloyl group.
Inventors:
YAMAGUCHI KEIGO (JP)
Application Number:
PCT/JP2023/027215
Publication Date:
February 01, 2024
Filing Date:
July 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; B32B7/06; B32B27/30; B32B27/34; G03F7/004; G03F7/037; G03F7/20; G03F7/38
Domestic Patent References:
| WO2021002395A1 | 2021-01-07 |
Foreign References:
| JP2020533419A | 2020-11-19 | |||
| JP2008070477A | 2008-03-27 | |||
| JP2020154205A | 2020-09-24 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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