Title:
TRANSFER FILM, METHOD FOR PRODUCING LAMINATE, LAMINATE, TOUCH PANEL SENSOR, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2021/065317
Kind Code:
A1
Abstract:
Provided is a transfer film in which bubbles do not readily occur in a bonded surface, when bonding to a substrate. In addition, a method for producing a laminate, a laminate, a touch panel sensor, and a touch panel are provided. The transfer film has a temporary support, a conductive layer, and a photosensitive resin layer. The maximum width of undulation in the transfer film is no more than 300 μm.
Inventors:
HIRAKI DAISUKE (JP)
TOYOOKA KENTARO (JP)
TOYOOKA KENTARO (JP)
Application Number:
PCT/JP2020/033347
Publication Date:
April 08, 2021
Filing Date:
September 03, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B3/14; B32B27/00; B32B3/18; B32B7/06; B32B27/30; G03F7/004; G03F7/027; G03F7/033; G03F7/11; G06F3/041; G06F3/044
Domestic Patent References:
| WO2010021224A1 | 2010-02-25 |
Foreign References:
| JPH0312402A | 1991-01-21 | |||
| JP2017068158A | 2017-04-06 | |||
| JP2017072679A | 2017-04-13 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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