Title:
TRANSFER FILM, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING CIRCUIT WIRING LINE
Document Type and Number:
WIPO Patent Application WO/2022/065049
Kind Code:
A1
Abstract:
The present invention provides: a transfer film which has excellent patterning properties, while having excellent releasability; a method for producing a multilayer body; and a method for producing a circuit wiring line. A transfer film according to the present invention sequentially comprises a provisional support, a photosensitive composition layer that is arranged on the provisional support, and a protective film in this order; the provisional support comprises a provisional support main body, a first layer that is arranged on one surface of the provisional support main body, and a second layer that is arranged on the other surface of the provisional support main body; among the first layer and the second layer, the first layer is arranged on the photosensitive composition layer side; the first layer contains first organic particles that have an average particle diameter of from 100 nm to 1,000 nm, and first inorganic particles that have an average particle diameter of 70 nm or less; the surface of the first layer, said surface being in contact with the photosensitive composition layer, has a kurtosis Rku of from 2.0 to 100; and the second layer contains second inorganic particles that have an average particle diameter of 70 nm or less, or alternatively does not contain inorganic particles.
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Inventors:
ARITOSHI YOHEI (JP)
Application Number:
PCT/JP2021/033130
Publication Date:
March 31, 2022
Filing Date:
September 09, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/023; G03F7/004; G03F7/027; G03F7/09; G06F3/041
Domestic Patent References:
| WO2012081680A1 | 2012-06-21 | |||
| WO2018061506A1 | 2018-04-05 |
Foreign References:
| JP2009092818A | 2009-04-30 | |||
| JP2009046527A | 2009-03-05 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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