Title:
TRANSFER FILM, METHOD FOR PRODUCING TRANSFER FILM, PATTERN FORMING METHOD, METHOD FOR PRODUCING CIRCUIT WIRING LINE, AND METHOD FOR PRODUCING TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2023/033065
Kind Code:
A1
Abstract:
One problem to be addressed by the present invention is to provide a transfer film which is capable of forming a pattern that has a low dielectric constant, while exhibiting excellent followability to level difference when bonded. Another problem to be addressed by the present invention is to provide a pattern forming method, a method for producing a circuit wiring line and a method for producing a touch panel, the methods being associated with the transfer film. A transfer film according to the present invention sequentially comprises a provisional supporting body, a thermoplastic resin layer and a photosensitive layer in this order; the photosensitive layer contains a compound A that has a carboxy group; and the content of the carboxy group is decreased by irradiation of active light or radiation.
Inventors:
YAMAGUCHI KEIGO (JP)
KODAMA KUNIHIKO (JP)
KODAMA KUNIHIKO (JP)
Application Number:
PCT/JP2022/032836
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/033; G03F7/11; G03F7/20; G03F7/40; G06F3/041
Foreign References:
| JP2018100988A | 2018-06-28 | |||
| JP2015146038A | 2015-08-13 | |||
| JP2016139154A | 2016-08-04 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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