Title:
TRANSFER METHOD AND TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190595
Kind Code:
A1
Abstract:
The present invention addresses the problem of transferring an element such as a semiconductor chip with high precision and with a simple configuration. Specifically, provided is a transfer method for transferring, to a transfer-receiving substrate via laser lift-off, elements (1) that arranged at least along a first direction on a first main surface of a transfer substrate (20) and are held by a holding layer (10), said transfer method being characterized in that a first element transfer step is performed in which a region centered on the holding layer (10) holding a first element (1) to be transferred is irradiated from the second main surface side of the transfer substrate (20) with a laser using a first laser spot (50) of a size that irradiates a region larger than the entire area of at least one first element (1) to be transferred, the holding layer (10) holding the entire area of the first element (1) to be transferred is irradiated with a laser having an energy capable of separating the first element (1) to be transferred, and the first element (1) is transferred to the transfer-receiving substrate (30).
Inventors:
IMAI KOICHI (JP)
TERADA TOYOHARU (JP)
TERADA TOYOHARU (JP)
Application Number:
PCT/JP2023/012664
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L33/48; H01L21/67; H01L21/683; H01L33/00
Domestic Patent References:
| WO2020166301A1 | 2020-08-20 | |||
| WO2021117753A1 | 2021-06-17 |
Foreign References:
| US20200357779A1 | 2020-11-12 | |||
| JP2021061394A | 2021-04-15 | |||
| US20210098390A1 | 2021-04-01 |
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