The present invention relates to a transferring assembly and a method for transferring a radiofrequency identification device, or RPID device, onto an object.

Radiofrequency identification devices consist of a microchip connected to an antenna made of a conductive material. The antenna made of a conductive material is mainly made according to three techniques.

A first technique provides for printing the antenna on a supporting element, using a conductive, for example silver- based ink. This technique has been found to be unsuitable in the case of RFID devices to be applied to various types of objects, in particular to labels for items of clothing. A second technique provides for making the antenna by chemical etching of an electrically conductive metal sheet, for example copper or aluminium, coupled with a film made of plastics, generally a polyester film.

The RPID devices that are made using this second technique have the drawback that, when they are applied to the surface of a thin and flexible object, such as, for example, objects made of paper, or labels for items of clothing, make such objects too thick and stiff, which, for example in the case of label, can be irritating for a person wearing an item of clothing with said label, further it could damage the item of clothing following repeated washing and ironing cycles. Also in the case of application to stiff objects, RFID devices made according to said second technique form a clear ridge on the surface of the object, which may be aesthetically displeasing.

A third technique provides for forming the antenna made of electrically conductive wire by applying or incorporating, as disclosed, for example in patents US 6,233,818 and EP 0 880 754, to a film of plastics or paper. With these known techniques the radiofrequency identification device always forms an assembly that is not dissociable with the film of plastics or paper and thus said film is always inserted or applied to the final object with the same drawbacks or contraindications already disclosed for the antennas made of etched metal.

The present invention aims to provide a transferring assembly and a method for transferring a radiofrequericy identification device onto an object without the aforesaid drawbacks occurring and thus without the need for the film of plastics or paper used for manufacturing having to be applied together with the radiofrequency device to the final object. According to a first aspect of the present invention a transferring assembly is provided for transferring to an object an RFID identification device, said RFID identification device comprising a microchip connected to an antenna made with a wire of electrically conductive material, characterised in that it comprises a supporting element to which a film or layer of adhesive material is applied, at least a RFID identification device being applied to said film of adhesive material, said adhesive material, and/or said supporting element, being chosen so that said adhesive material has an adhesiveness on a surface of said object that is significantly greater than the adhesiveness of said film on said supporting element .

According to a further aspect of the present invention a method is provided for transferring to an object an RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, characterised in that it comprises applying a film of adhesive material to a supporting element, applying said microchip to said film of adhesive material' ¹ in a zone of said supporting element, forming said antenna by applying said wire made of electrically conductive material to said film of adhesive material and electrically connecting said antenna to said microchip, heating said supporting element in said zone and pressing said zone against the surface of said object, with the RFID device facing said surface, said adhesive material, and/or said supporting element, being chosen so that said adhesive thermoplastic has an adhesiveness on said surface that is significantly greater than the adhesiveness of said film on said supporting element. Owing to the invention, the RFID device can be applied very simply and rapidly to the surface of an object, for example to a label of an item of clothing, or to the item of clothing, heating the supporting element in the zone to which the RFID device is applied and pressing the film of adhesive thermoplastic to the surface of the object so as to transfer the RFID device with the adhesive material to said surface and glue the RFiD device to the surface . The thickness and weight of the RFID device and of the layer of adhesive are very reduced, so the presence of the RFID device on the object is substantially imperceptible, in particular, in the case of a label, the RFiD device does not significantly alter the flexibility and the thickness of the label.

Alternatively, the RFID device can be applied directly to the item of clothing, for example below a hem, before it is sewn.

The RFID device according to the invention can further be applied to a surface of any flexible or stiff object. K manner of implementing the invention is illustrated by way of. non- limiting example in the set of attached drawings in which:

Figure 1 is a plan view of a transferring assembly according to the invention by means of which it is possible to transfer a RFID device to the surface of an object; Figures 2 and 3 illustrate applying the RFID device to a continuous substrate and to an item of clothing. In Figure 1, there is illustrated a transferring assembly I according to the invention that comprises a supporting element 7 to which a film 6 of adhesive material is applied, preferably a thermoplastic or thermohardening adhesive material .

The film or layer of adhesive material 6 can cover the entire surface of the supporting element 7 or can be applied only to the zones intended for the transfer, for example by means of silkscreen printing. A RFID device 1, or a plurality of RPID devices 1 distributed on said film 6 is applied to the film 6 of adhesive material .

Each RFID device 1 comprises a modular element 2 consisting of a microchip 3 , connected to contact elements 4 made of electrically conductive material, and an antenna 5 made with a wire made of electrically conductive material connected to the contact elements 4. Advantageously, the antenna 5 ςomprises a single coil, for example circular or substantially rectangular, and the electrically conductive material is copper.

The adhesive material of the film 6, and/or the supporting element 7 , are chosen so that the adhesiveness of the adhesive material to the supporting element 7 is noticeably less than the adhesiveness of said adhesive to the surface of an object 8, 16 to which a RFID device l is intended to be applied.

The supporting element 7 can be advantageously a supporting element made of silicone-coated paper or silicone-coated plastic film. .The RFID device 1 according to the invention is made by placing on the supporting element 7 the film 6 of adhesive material, by applying the modular element 2 on said film 6, forming the antenna 5 on said film 6 and electrically connecting the antenna 5 to the contact elements 4 of the microchip 3. In order to transfer the RFlD device 1 to a label, or directly to an item of clothing 16, or to any object 8, it is sufficient, if the film 6 is made of thermoplastic or thermohardening adhesive material, to heat the support 7 in 5 the zone to which the film 6 of adhesive is applied and press said film 6 lightly on the surface of the label or on a surface of the item of clothing 16, or of an object 8, so as to transfer the film 6 with the RFID device 1 applied thereto to said surface. The transfer occurs owing to the

10 fact that the adhesiveness of the film 6 on the surface of the label, or of the item of clothing, or of the object, is much greater than the adhesiveness of the film 6 to the support 7. After the transfer has been completed, the thermoplastic

15 adhesive cools and ensures stable gluing of the radiofreguency identification device 1 to the label, or to the item of clothing, or to the object. if the adhesive material is not a thermoplastic or thermohardening adhesive material, it is sufficient to press

20 the supporting element 7 onto the surface of the object 8 to which the RFID device has to be applied, the transfer occurring owing to the greater adhesiveness of the adhesive material to the surface of the object 8. If the RPID device 1 according to the invention is applied

25 to an item of clothing, it is advantageous to use as an adhesive material an adhesive material of the type used in items of clothing to replace stitches or for applying decorations. This ensures that the adhesive material does not suffer alterations following washing and ironing cycles

30 to which the item of clothing is subjected to which the label with the RFID device or the RFID device itself is applied, which alterations could cause the RFID circuit to become detached or could damage the aesthetic appeal of the item of clothing.

^; 3 ^: 5 In Figures 2 and 3 there are illustrated two examples of transferring the RFID device to the surface of an object, for example to a substrate 8 in the form of a strip (Figure 2), or to an item of clothing 16 (Figure 3).

With reference to Figure 2, a supporting element 7, with a film 6 of adhesive material, preferably thermoplastic or thermohardening adhesive material and a plurality of RPID devices applied to said film 6, is unwound from a first reel 9 on which the supporting element 7 was previously wound, and guided to a transferring device 10, consisting for example of a possibly heated punch Ii . The transferring device 10 is applied to the surface of the supporting element 7 opposite which the film 6 of adhesive and the RFID devices I are applied, in a zone at which there is a radiofrequency identification device 1. The transferring device 10 exerts pressure on said zone of the support 7,pressing the zone against the substrate 8, unwound from a second reel 13.

If the adhesive material of the film 6 is a thermoplastic or therraohardening material, the transferring device 10, in addition to exerting a pressure on said zone of the supporting element I ₁ heats the zone to cause softening, or melting, of the adhesive material.

In this latter case, owing to the pressure and the heating carried out by the transferring device 10, the zone of the film 6 of thermoplastic or thermohardening adhesive to which the RFID device 1 is applied melts and the RPID device 1 is transferred with the adhesive to the substrate 8, owing to the fact that the thermoplastic adhesive is chosen so that the adhesiveness thereof on the surface of the substrate 8 is noticeably greater than the adhesiveness on the support 7. If the adhesive material is not a thermoplastic or thermohardening material the transfer occurs by the mere pressure exerted by the transferring device 10 and the greater adhesiveness of the adhesive material on the surface of the substrate 8. After applying the RFID devices to the substrate 8, the support 7, which is now devoid of the RFiD devices and of the adhesive in the zones that have come into contact with the punch 11 and have been subjected to the pressure thereof, is wound around a third reel 12 and the substrate 8 with the RPID devices 1 applied thereto is wound around a fourth reel 14.

Before applying the RFID devices I to the substrate 8, it is advantageous to test the integrity of each RFID device 1, by means of a testing device 15 place between the first reel 9 and the transferring device 10. If the testing device detects that a RFID device 1 is faulty, the latter is not applied to the substrate 8.

In Figure 3 there is illustrated the transfer of a RFDI device 1 to an item of clothing 16. The transfer occurs in a manner that is completely analogous to the transfer onto a substrate 8 that has been previously disclosed by pressing onto a surface of the item of clothing 16 via the transferring device 10, a zone of the support 7 at which a RFID device 1 is applied and possibly heating said zone via the transferring device 10. In the practical embodiment, the material, the dimensions and the constructional details may be different from those indicated but be technically equivalent thereto without thereby falling outside the scope of the present invention, as defined by the claims .