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Title:
TRANSMISSION LINE SUBSTRATE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/218267
Kind Code:
A1
Abstract:
A transmission line substrate (101) includes a line portion (TL) and a connecting portion (CN1, CN2). The transmission line substrate (101) is also provided with a laminated body (10), and a first signal line (SL1), a ground conductor (G11 to G13), and a ground conductor (G21 to G23) which are formed in the laminated body (10). In the line portion (TL), a strip line including the first signal line (SL1) and first and second ground conductors is formed. The line portion (TL) includes a first region (F1A, F1B) and a second region (F2). The first signal line (SL1) has a second portion which is positioned in the second region (F2) and of which the line width is smaller than the line width of a first portion thereof positioned in the first region (F1A, F1B). An interval between the first ground conductor and the second ground conductor in the second region (F2) is narrower than that in the first region (F1A, F1B).

Inventors:
NAGAI TOMOHIRO (JP)
Application Number:
PCT/JP2020/017127
Publication Date:
October 29, 2020
Filing Date:
April 21, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/02; H01B7/08; H01B7/18; H01B11/00; H01P3/08; H05K1/02
Domestic Patent References:
WO2013069763A12013-05-16
WO2016056496A12016-04-14
Foreign References:
JP2002158411A2002-05-31
JP2001339126A2001-12-07
JP2001144451A2001-05-25
JP2014030172A2014-02-13
JPH11177247A1999-07-02
JPH07106766A1995-04-21
JP2017092486A2017-05-25
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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