Title:
TRANSPARENT ADHESIVE COMPOSITION, FILM-LIKE TRANSPARENT ADHESIVE, METHOD FOR MANUFACTURING TRANSPARENT ADHESIVE CURED LAYER-PROVIDED MEMBER, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/070503
Kind Code:
A1
Abstract:
The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a film-like transparent adhesive obtained by processing said composition; and a method for manufacturing a transparent adhesive cured layer-provided member, a method for manufacturing an electronic component, and an electronic component, all of which using said film-like transparent adhesive. (1) Being a powder and having a particle diameter (d90) at a cumulative distribution frequency of 90% of 2.0 μm or less.
(2) Having a solubility of 0.1 g or less with respect to 100 g of methyl ethyl ketone at 25°C.
Inventors:
MORITA MINORU (JP)
SAKAI KOYUKI (JP)
WATAHIKI KEITA (JP)
SAKAI KOYUKI (JP)
WATAHIKI KEITA (JP)
Application Number:
PCT/JP2021/020043
Publication Date:
April 07, 2022
Filing Date:
May 26, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J11/04; C09J7/35; C09J163/00; C09J171/12; H01L21/52
Domestic Patent References:
| WO2014054631A1 | 2014-04-10 | |||
| WO2017158994A1 | 2017-09-21 |
Foreign References:
| JP2016058457A | 2016-04-21 | |||
| JP2019143085A | 2019-08-29 | |||
| JPH06256746A | 1994-09-13 | |||
| JP2021034574A | 2021-03-01 | |||
| JPS6336905B2 | 1988-07-22 | |||
| JP2020163561A | 2020-10-08 |
Other References:
See also references of EP 4047065A4
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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