Title:
TRANSPARENT CONDUCTIVE LAMINATE AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2014/119091
Kind Code:
A1
Abstract:
This transparent conductive laminate is provided with a highly adhesive film, which comprises a highly adhesive layer on one surface of a transparent film substrate, and a transparent conductive layer on the other surface thereof. Furthermore, another film substrate is bonded to the highly adhesive layer with a transparent curable adhesive layer interposed therebetween. The highly adhesive layer is formed from a composition that: contains a polymer component; and has a functional group that can form a cross-linked structure. Oligomers that precipitate out of the highly adhesive layer after a heat treatment mass no more than 1.0 mg/m2. This transparent conductive laminate adheres well to a curable adhesive layer and makes it possible to prevent oligomer precipitation even if the transparent conductive layer is formed on the highly adhesive layer by means of a process that includes heat treatment.
Inventors:
INUI KUNIHIRO (JP)
OKAMOTO MIKI (JP)
SAITO TAKESHI (JP)
OKAMOTO MIKI (JP)
SAITO TAKESHI (JP)
Application Number:
PCT/JP2013/081179
Publication Date:
August 07, 2014
Filing Date:
November 19, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/16; B32B7/12; G06F3/041; H01B5/14
Foreign References:
| JP2012250498A | 2012-12-20 | |||
| JP2012116046A | 2012-06-21 | |||
| JP2004195775A | 2004-07-15 | |||
| JP2007320146A | 2007-12-13 | |||
| JP2009226774A | 2009-10-08 | |||
| JP2011020266A | 2011-02-03 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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