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Patent Searching and Data


Title:
TRANSPARENT CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/044448
Kind Code:
A1
Abstract:
[Problem] To provide a transparent conductive substrate having good optical characteristics and electrical characteristics, and in addition, excellent bending resistance. [Solution] A transparent conductive substrate comprising: a transparent substrate; and a transparent conductive film that is formed on at least one main surface of the transparent substrate and that contains a binder resin and conductive fibers, wherein the straightness of a cut portion of the transparent substrate is at most 0.050 mm. The transparent substrate is preferably a long-body resin film or one that is cut out of a long-body resin film, and is preferably configured to be folded along a direction perpendicular to the longitudinal direction of the long body as a bending axis.

Inventors:
YAMAKI SHIGERU (JP)
YONEDA SHUHEI (JP)
Application Number:
PCT/JP2021/018744
Publication Date:
March 03, 2022
Filing Date:
May 18, 2021
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C09D5/24; B32B7/023; B32B7/025; C09D7/61; C09D201/00; G06F3/041; H01B5/14
Domestic Patent References:
WO2018101334A12018-06-07
WO2019151293A12019-08-08
WO2018003713A12018-01-04
WO2018101334A12018-06-07
WO2008073143A22008-06-19
WO2008046058A22008-04-17
Foreign References:
JP2011035213A2011-02-17
JP2020102362A2020-07-02
JP2013225460A2013-10-31
Other References:
J. AM. CHEM. SOC., vol. 129, 2007, pages 1733
J. AM. CHEM. SOC., vol. 126, 2004, pages 3892 - 3901
See also references of EP 4119621A4
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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