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Patent Searching and Data


Title:
TRANSPARENT CONDUCTOR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/190227
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a transparent conductor, which has excellent light transmissivity, and excellent conductivity between connection wiring and a conductive layer. Disclosed is a method for manufacturing a transparent conductor that has at least a conductive layer, an insulating layer, and connection wiring electrically connected to the conductive layer. The method is characterized in electrically connecting the conductive layer and the connection wiring to each other by means of an electrically connecting step wherein the connection wiring is formed on a surface end section of the insulating layer, then, an alternating current voltage is applied between the conductive layer and the connection wiring.

Inventors:
HIRATA KENICHIRO (JP)
KASUYA JINICHI (JP)
TADA KAZUNARI (JP)
Application Number:
PCT/JP2015/064154
Publication Date:
December 17, 2015
Filing Date:
May 18, 2015
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C23C14/14; H01B13/00; G06F3/041; G06F3/044; H01B1/22; H01B3/02
Foreign References:
CN102677012A2012-09-19
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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