Title:
TWO-COMPONENT ACRYLIC ADHESIVE FOR FORMING MOLD MODEL AND BONDING METHOD USING SUCH ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2006/046602
Kind Code:
A1
Abstract:
Disclosed is a two-component acrylic adhesive containing a polymerizable monomer (A), an organic peroxide (B), a vanadium compound (C) and an acidic phosphate compound (D). Not less than 80 % by mass of the component (A) is composed of a (meth)acrylate having a specific molecular structure and a specific molecular weight.
Inventors:
ARAI YASUO (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
Application Number:
PCT/JP2005/019692
Publication Date:
May 04, 2006
Filing Date:
October 26, 2005
Export Citation:
Assignee:
CEMEDINE CO LTD (JP)
OKURA INDUSTRIAL CO LTD (JP)
KANEKA CORP (JP)
ARAI YASUO (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
OKURA INDUSTRIAL CO LTD (JP)
KANEKA CORP (JP)
ARAI YASUO (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
International Classes:
C09J4/02; B22C7/02; C09J5/04; C09J167/07; C09J171/00
Foreign References:
JPH04371350A | 1992-12-24 | |||
JPH04371342A | 1992-12-24 | |||
JPH06192633A | 1994-07-12 | |||
JP2002307133A | 2002-10-22 | |||
JPS5876414A | 1983-05-09 |
Attorney, Agent or Firm:
Kawaguchi, Yoshiyuki (4-10 Higashi Nihonbashi 3-chom, Chuo-ku Tokyo 04, JP)
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