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Patent Searching and Data


Title:
TWO-COMPONENT ACRYLIC ADHESIVE FOR FORMING MOLD MODEL AND BONDING METHOD USING SUCH ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2006/046602
Kind Code:
A1
Abstract:
Disclosed is a two-component acrylic adhesive containing a polymerizable monomer (A), an organic peroxide (B), a vanadium compound (C) and an acidic phosphate compound (D). Not less than 80 % by mass of the component (A) is composed of a (meth)acrylate having a specific molecular structure and a specific molecular weight.

Inventors:
ARAI YASUO (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
Application Number:
PCT/JP2005/019692
Publication Date:
May 04, 2006
Filing Date:
October 26, 2005
Export Citation:
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Assignee:
CEMEDINE CO LTD (JP)
OKURA INDUSTRIAL CO LTD (JP)
KANEKA CORP (JP)
ARAI YASUO (JP)
DOI HIDEMI (JP)
UMENOKI TATSURO (JP)
NOGUCHI KIYOYUKI (JP)
International Classes:
C09J4/02; B22C7/02; C09J5/04; C09J167/07; C09J171/00
Foreign References:
JPH04371350A1992-12-24
JPH04371342A1992-12-24
JPH06192633A1994-07-12
JP2002307133A2002-10-22
JPS5876414A1983-05-09
Attorney, Agent or Firm:
Kawaguchi, Yoshiyuki (4-10 Higashi Nihonbashi 3-chom, Chuo-ku Tokyo 04, JP)
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