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Patent Searching and Data


Title:
TWO-COMPONENT SOLVENT-LESS ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/124542
Kind Code:
A1
Abstract:
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol and (ii) optionally, a polyol selected from a polyether polyol, a polyester polyol, and combinations thereof. The two-component solvent-less adhesive composition contains from 15 wt% to 45 wt% units derived from dimer acid, based on the total weight of the two-component solvent-less adhesive composition.

Inventors:
SHI RUI (CN)
QU ZHAOHUI (CN)
GUO YINZHONG (US)
Application Number:
PCT/CN2018/122618
Publication Date:
June 25, 2020
Filing Date:
December 21, 2018
Export Citation:
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Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
ROHM & HAAS (US)
SHI RUI (CN)
QU ZHAOHUI (CN)
GUO YINZHONG (US)
International Classes:
C08G18/10; B32B7/12
Foreign References:
US20060052523A12006-03-09
US20060074214A12006-04-06
CN102427934A2012-04-25
US20170204310A12017-07-20
Other References:
See also references of EP 3898739A4
Attorney, Agent or Firm:
WU, FENG & ZHANG (CN)
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