Title:
TWO-LAYERED FLEXIBLE WIRING SUBSTRATE, FLEXIBLE WIRING BOARD, AND METHODS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/161507
Kind Code:
A1
Abstract:
[Problem] To provide a two-layered flexible wiring substrate and a flexible wiring board which are of excellent folding resistance, and methods for producing same. [Solution] A two-layered flexible wiring substrate of a multilayered structure in which an underlying metal layer composed of nickel alloy is provided to the surface of a polyimide film, with no intervening adhesive, and a copper layer is provided to the surface of the underlying metal layer, wherein the two-layered flexible wiring substrate is characterized in that the difference d[(200)/(111)] in the crystal orientation ratio [(200)/(111)] of the copper layer obtained before and after conducting the folding resistance test stipulated in JIS C-5016-1994 is 0.03 or greater.
Inventors:
TAKENOUCHI HIROSHI (JP)
NOGUCHI MASASHI (JP)
KOUKAMI SEIJI (JP)
HATA HIROKI (JP)
SHIMAMURA TOMIO (JP)
NISHIYAMA YOSHIHIDE (JP)
NOGUCHI MASASHI (JP)
KOUKAMI SEIJI (JP)
HATA HIROKI (JP)
SHIMAMURA TOMIO (JP)
NISHIYAMA YOSHIHIDE (JP)
Application Number:
PCT/JP2013/059363
Publication Date:
October 31, 2013
Filing Date:
March 28, 2013
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H05K1/03; B32B15/08; B32B15/088; C23C14/14; C23C14/20; H05K3/18
Foreign References:
| JP2011017036A | 2011-01-27 | |||
| JP2008130585A | 2008-06-05 | |||
| JP2009295656A | 2009-12-17 | |||
| JP2009298065A | 2009-12-24 | |||
| JP2004091648A | 2004-03-25 |
Attorney, Agent or Firm:
OSHIDA Yoshitaka (JP)
Yoshitaka Oshida (JP)
Yoshitaka Oshida (JP)
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