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Patent Searching and Data


Title:
TWO-PACK TYPE CURABLE COMPOSITION SET, CURED PRODUCT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190439
Kind Code:
A1
Abstract:
The present invention provides a two-pack type curable composition set which comprises: a first agent that contains a copolymer A1, a vinyl-modified organopolysiloxane B1, a thermally conductive filler C1 and an addition reaction catalyst D1; and a second agent that contains a copolymer A2, a vinyl-modified organopolysiloxane B2, a thermally conductive filler C2 and a hydrosilyl-modified organopolysiloxane E2. With respect to this two-pack type curable composition set, the copolymer A1 and the copolymer A2 each have a (meth)acrylic monomer unit α that has a carboxy group, a (meth)acrylic monomer unit β that has a tertiary amino group, and a (meth)acrylic monomer unit γ that has a siloxane skeleton; and if the first agent and the second agent are mixed with each other in equal volumes, the time necessary for the mixture to achieve a loss tangent tanδ of less than 0.20 is 24 hours or less after the mixing.

Inventors:
ONOZUKA MASAO (JP)
KANAI TOMOYUKI (JP)
Application Number:
PCT/JP2023/012376
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L83/07; C08K3/013; C08L83/05; C08L83/10; H01L23/36
Domestic Patent References:
WO2020080256A12020-04-23
WO2021246397A12021-12-09
WO2022075306A12022-04-14
Foreign References:
JP2003034784A2003-02-07
JP2016121350A2016-07-07
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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